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Power Modules

Power Modules

Power Modules

Heritage

SSDI's 1st Power Module (c. 1992)
In 1992, SSDI launched the first hermetic application specific power module for space flight, combining the reliability of discrete semiconductors with the design advantages of conventional power hybrids. SSDI's power module configurations include, but are not limited to:
  • Three phase bridge
  • Half bridge switch
  • Full bridge switch
  • Boost converter
  • Buck converter
  • Double forward converter
  • Thrust vector controls

Power Module Advantages over Power Hybrid Technology
  • Improved Performance - discrete components are tested at full current / power ratings and can be selected for matched performance prior to PM assembly
  • Improved Reliability - uses prescreened & qualified components and thermally matched materials to maximize power evacuation while minimizing thermal stress
  • Higher Working Currents and Lower Conduction Losses– replaces wire bonds with heavy gauge, high current handling heatsunk copper traces
  • Weight Reduction – uses lightweight materials
  • Simplified Next Level Assembly – terminations optimally located to interface with the system
  • Any Size or Shape – takes full advantage of available system real estate, including 3D capability
  • Any Terminal Type– high power threaded, soldered male/female turrets, flex cable, power bar, etc; mix & match different control and power connections
  • Repairable / Reworkable

Material Technology

  • Hermetic SMT components
  • DBC substrate, typ 5 - 8 mil thick copper
  • Ceramic: typically alumina (Al2O3); Aluminum Nitride (AlN) for thermally challenging applications
  • Rugged I/O connections: typically Beryllium Copper (BeCu) for enhanced hardness
  • Baseplate: typically AlSiC, used as an electrically isolated heat spreader and mechanical interface
  • High voltage potting

Performance / Features

  • High thermal conductivity
  • Layout optimized for circuitry and I/O
  • Includes passive components such as:
    • Thermistors or current sense resistors
    • Capacitors
    • Inductors
  • Thermal stress minimization via CTE matched materials
  • Application specific solution
  • Simplifies procurement with single item

Sedpack 2: RθJC = 0.7°C/W

Substrate AlN Al203
t 0.025 in. 0.025 in.
W 0.315 in. 0.315 in.
L 0.315 in. 0.315 in.
K 170 W/m°K 20 W/m°K
Thermal Resistance 0.06°/W 0.50°/W

 
Examples of Power Modules

Battery Bypass Module

Battery Bypass Module
  • Application: space / satellite
  • 450 A / leg discharge, 50 A / leg charge
  • AlSiC baseplate, CTE matched components

Three Phase IGBT Bridge

Three Phase IGBT Bridge
  • Application: launch vehicle
  • 600 A, 600 V

Four Cell High Current Schottky Power Diodes

Schottky Centertap Assembly
  • High current Schottky centertap assembly
  • AlSiC baseplate, CTE matched components

Battery Bypass Module

Battery Bypass Module
  • Rad hard half bridge MOSFET
  • Application: space level / non-repairable
  • Two power MOSFETs in parallel for current enhancement
  • Dual independently controlled channels
  • 125 W, 200 V DC
  • 27 A steady state current, 65 A peak current
  • AlSiC baseplate, CTE matched components

Battery Charge Power Module

Battery Charge Power Module
  • Application: space
  • 60 A, 1000 V for use with NiH2 batteries, hermetically sealed
  • VR = 1 kV, IO = 60 A
  • AlSiC baseplate
  • Temperature range: -65°C to +150°C
  • 27 A steady state current, 65 A peak current

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